Circuit Stability Under Process Variability and Electro-Thermal-Mechanical CouplingBelow you will find project highlights (including references). Material for download can also be found in the sections on Events and Publications.
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Workshop at ESSDERC 2015 → Material for download |
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Reference paper from SISPAD 2014 → Download |
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Coupled Equipment and Feature-Scale Simulation for Studying TSV Performance and Reliability → more info |
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Simulation of Self Heating of FinFETs → more info |
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Hierarchical Simulation of Variability → more info |