Circuit Stability Under Process Variability and Electro-Thermal-Mechanical CouplingEuropean Nanoelectronics Forum 2016
November 23-24, 2016, Rome, Italy
SUPERTHEME poster at ENF
Events
International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) 2016
(organized by Fraunhofer IISB)
September 6-8, 2016, Nuremberg, Germany
In 3 papers at SISPAD 2016, results of SUPERTHEME were shown, please refer to the SUPERTHEME publications list for further information.
The SISPAD 2016 workshop WS3 (Variability-Aware Design Technology Co-Optimization) were organized in cooperation with SUPERTHEME.
Presentation by J. Lorenz at WS3 on "Outline and Selected Results of the EC FP7 Project SUPERTHEME"
European Nanoelectronics Forum 2015
December 1-2, 2015, Berlin, Germany
ESSDERC 2015, Workshop 3:
"Variability – From Equipment to Circuit Level"
Friday, September 18, 2015
Graz University of Technology, Campus Inffeldgasse
International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) 2015
September 9-11, 2015, Washington DC, USA
The following papers at SISPAD 2015 report on SUPERTHEME results:
A. Burenkov et al., Simulation of Plasma Immersion Ion Implantation into Silicon Download
L. Wang et al., 3D Electro-Thermal Simulations of Bulk FinFETs with Statistical Variations Download
X. Wang et al., Hierarchical Variability-Aware Compact Models of 20nm Bulk CMOS Download
SISPAD 2014, September 9-11, 2014, Yokohama
The following papers at SISPAD 2014 reported on SUPERTHEME results:
L. Filipovic et al., Three-Dimensional Simulation for the Reliability and
Electrical Performance of Through-Silicon Vias Download
J. Lorenz et al., Simultaneous Simulation of Systematic and Stochastic
Process Variations Download
L. Wang et al., 3D Coupled Electro-Thermal FinFET Simulations Including the
Fin Shape Dependence of the Thermal Conductivity Download
X. Wang et al., Variability-aware Compact Model Strategy for 20-nm Bulk
MOSFETs Download